Kathmandu, May 2
The South Asia Trade Fair 2026,
scheduled from May 7-11 (Baisakh 24 to 28, 2083 BS) in Kathmandu, is bringing
together industry, trade, and service opportunities of South Asia on a single
platform.
The fair is expected to include
participation from countries such as India, Bangladesh, Nepal, Bhutan,
Pakistan, Afghanistan, Sri Lanka, and Maldives, organisers informed in a
statement on Saturday.
The event is organised by Introduction
Trade Shows Nepal Pvt. Ltd. in cooperation with the Ministry of Industries of
Bangladesh and the Export Promotion Bureau (EPB) of Bangladesh. It is endorsed
and supported by the Ministry of Industry, Commerce and Employment of the
Government of Bhutan, along with various governmental and private sector organisations.
Supporting organizations
include the Nepal Chamber of Commerce, Federation of Nepal Cottage and Small Industries,
Lalitpur Chamber of Commerce and Industry, Bhaktapur Chamber of Commerce and
Industry, Chamber of Industries Morang, Lalitpur Chamber of Commerce,
Nepal-China Executive Council, Nepal Cosmetics Business Association and Vishwa
Udyam Sahayata Foundation, among others
Product promotion and service
expansion, market opportunity exploration, and strengthening buyer–seller
cooperation are the primary objectives of the Fair. It also aims to further
enhance business relations between different countries.
The fair will feature products
and services from various sectors such as clothing and ready-made garments,
beauty products, handicrafts, transportation and automotive parts, furniture,
agricultural products, information technology, household appliances, and other
goods and services.
In addition, business meetings,
seminars, cultural programmes, and entertainment activities will also be
conducted. The event is expected to create new opportunities for investment and
business expansion in Nepal and abroad.
"The exhibition will
provide support for brand promotion and business expansion," read the
statement.
Published in The Rising Nepal daily on 3 May 2026.
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